Wafer Dicing txheej txheem

Cov txheej txheem tseem ceeb rau silicon wafer scribing yog pob zeb diamond log scribing thiab laser scribing. Laser scribing siv qhov kub thiab txias generated los ntawm kev tsom ntawm lub siab-zog laser beam kom instantly vaporize cov khoom silicon nyob rau hauv lub zos cheeb tsam ntawm lub irradiation kom tiav cov kev sib cais ntawm silicon wafers, tab sis qhov kub siab yuav ua rau thermal stress nyob ib ncig ntawm. slit, ua rau tawg ntawm silicon wafer ntug, thiab tsuas yog haum rau scribing ntawm nyias wafers. Ultra-nyias pob zeb diamond log scribing yog tam sim no feem ntau siv scribing txheej txheem vim me me txiav quab yuam generated los ntawm scribing thiab tus nqi qis ntawm scribing.
Vim lub nkig thiab tawv yam ntxwv ntawm silicon wafers, cov txheej txheem scribing yog nquag mus rau defects xws li ntug vau, microcracks, thiab delamination, uas ncaj qha cuam tshuam rau txhua yam khoom ntawm silicon wafers. Nyob rau tib lub sijhawm, vim qhov siab tawv, tsis muaj zog, thiab tsis tshua muaj thermal conductivity ntawm silicon wafers, kev sib txhuam kub tsim thaum lub sij hawm scribing yog qhov nyuaj rau kev ua sai sai, uas tuaj yeem yooj yim ua carbonization thiab thermal tawg ntawm pob zeb diamond hais hauv cov hniav. , ua rau hnyav hnyav ntawm cov cuab yeej thiab cuam tshuam rau kev sau ntawv zoo.
Cov kws tshawb fawb hauv tsev thiab txawv teb chaws tau ua ntau yam kev tshawb fawb ntawm silicon wafer scribing technology. Zhang Hongchun et al. tsim kom muaj ib qho kev sib npaug ntawm kev co thiab cov txheej txheem dicing, thiab siv cov txheej txheem genetic algorithms kom tau txais cov txheej txheem zoo tshaj plaws uas cuam tshuam rau kev vibration me me. Lawv kuj tau txheeb xyuas los ntawm kev sim ua kom pom cov txheej txheem kev sib xyaw ua ke tuaj yeem txo qhov ntxaiv vibration thiab tau txais txiaj ntsig zoo dua dicing. Li Zhencai et al. pom tias lub sawing quab yuam generated los ntawm ultrasonic kev co-pab dicing yog me dua uas generated los ntawm ib leeg-crystal silicon dicing tsis muaj kev pab cuam ultrasonic, thiab xyuas los ntawm silicon wafer dicing thwmsim uas ultrasonic vibration yuav txo tau lub sawing quab yuam thiab suppress lub ntug vau ntawm silicon wafers. . Hauv kev teb rau cov teeb meem uas qis-K dielectric silicon wafers nyuaj rau dicing siv cov pob zeb diamond zoo tib yam, Nyiv lub tuam txhab Disco tau tsim cov txheej txheem laser grooving, uas thawj zaug qhib ob qhov zoo hauv txoj kev dicing, thiab tom qab ntawd siv cov hniav kom ua tiav. dicing nruab nrab ntawm ob grooves zoo. Cov txheej txheem no tuaj yeem txhim kho kev tsim khoom thiab txo qhov tsis zoo los ntawm cov yam tsis zoo xws li ntug kev tawg thiab delamination. Lu Xiong et al. ntawm Fudan University siv cov txheej txheem ntawm laser grooving ua raws li cov neeg kho tshuab hniav dicing rau diced low-k dielectric silicon wafer cov ntaub ntawv. Piv nrog cov hniav ncaj qha dicing, cov qauv nti ua tiav thiab tsis muaj txheej hlau ntog los yog flipping, tab sis cov txheej txheem yog cumbersome thiab tus nqi dicing yog siab. Yu Zhang et al. pom tias los ntawm kev ua kom cov damping piv ntawm cov txheej txheem kev sib hloov ntawm cov hniav, qhov tshwm sim ntawm kev vibration ntawm lub cuab yeej thaum lub sij hawm kev kub ceev kev sib hloov yuav raug txo mus rau ib tug npaum li cas, yog li txhim kho cov grooving kev ua tau zoo thiab txo qhov luaj li cas ntawm lub chipping ntug, tab sis tsis muaj nyob rau hauv- Kev tshawb fawb tob tau ua.
Ib qho dicing, uas yog, tag nrho dicing lub silicon wafer nyob rau hauv ib lub sij hawm, lub dicing qhov tob mus txog 1/2 ntawm UV zaj duab xis thickness, raws li qhia nyob rau hauv daim duab 4. Txoj kev no muaj ib tug yooj yim txheej txheem thiab yog haum rau dicing ultra-nyias cov ntaub ntawv, Tab sis cov cuab yeej hnav hnyav heev thaum lub sij hawm dicing txheej txheem, ntug ntawm lub dicing riam yog nquag mus rau chipping thiab microcracks, thiab lub nto morphology ntawm lub slit ntug yog tsis zoo.
Txheej dicing txheej txheem, raws li qhia nyob rau hauv daim duab 5. Raws li lub thickness ntawm cov khoom siv dicing, dicing yog ua los ntawm txheej txheej pub rau hauv dicing qhov tob kev taw qhia. Ua ntej, qhov slotting thiab scribing yog ua nrog ib tug me me pub qhov tob kom paub meej tias cov cuab yeej raug rau me me quab yuam, txo cov cuab yeej hnav, thiab txo cov ntug breakage ntawm scribing riam. Tom qab ntawd qhov scribing yog ua rau ib txoj hauj lwm uas UV zaj duab xis thickness yog 1/2.